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While it seems as though China is falling behind in sophisticated chip design and LLM architecture, the physical issues (EG cooling) are still a place where they might have a strategic advantage over western firms. I wonder how long that edge might last.
While it seems as though China is falling behind in sophisticated chip design and LLM architecture, the physical issues (EG cooling) are still a place where they might have a strategic advantage over western firms. I wonder how long that edge might last.